Committee

DPS 2016 » Committee

Committee Chairpersons

  • Organizing Committee Chair: Tetsuya Tatsumi (Sony Corp.)
  • Executive Committee Chair: Koichi Sasaki (Hokkaido University)
  • Program Committee Chair: Masanobu Honda(Tokyo Electron Miyagi Ltd.)
  • Publication Committee Chair: Kenj Ishikawa(Nagoya University)

Organizing Committee

Chair:  T. Tatsumi (Sony Semiconductor Solutions Corp.) Japan
Vice-chair:  K. Kinoshita (PETRA) Japan
H. Akatsuka (Tokyo Institute of Technology) Japan
N. Fujiwara (Mitsubishi Electric Corp.) Japan
S. Hamaguchi (Osaka University) Japan
H. Hayashi (Toshiba Corp.) Japan
M. Honda (TOKYO ELECTRON MIYAGI LTD.) Japan
M. Hori (Nagoya University) Japan
T. Ichiki (The University of Tokyo) Japan
K. Ishikawa (Nagoya University) Japan
N. Itabashi (Hitachi, Ltd.) Japan
M. Izawa (Hitachi High-Technologies Corp.) Japan
K. Karahashi (Osaka University) Japan
H. Kokura (Samsung Electronics Co., Ltd) Korea
T. Koshizawa (Applied Materials Inc.) USA
M. Matsui (Hitachi, Ltd.) Japan
K. Nojiri (Lam Research Corp.) Japan
T. Ohiwa (TOKYO ELECTRON LIMITED) Japan
T. Okumura (Panasonic Corp.) Japan
K. Sasaki (Hokkaido University) Japan
M. Sekine (Nagoya University) Japan

International Organizing Committee

A. Agarwal (Applied Materials) USA
T-H. Ahn (Samsung Electronics Co., Ltd.) Korea
W. Boullart (Interuniversity Microelectronics Center-IMEC) Belgium
J. Brcka (Tokyo Electron U.S. Holdings, Inc.) USA
H.Y. Chang (Korea Advanced Institute of Science and Technology) Korea
E-H. Choi (Kwangwoon University) Korea
O. Joubert (LTM/CNRS) France
K. C. Leou (National Tsing Hua University) Taiwan
T. Lill (Lam Research Corp.) USA
G. S. Oehrlein (University of Maryland) USA
L. Overzet (University of Texas at Dallas) USA
R. van de Sanden (DIFFER) Netherlands
P. Ventzek (Tokyo Electron U.S. Holdings, Inc.) USA
J.S. Wu (National Chiao Tung University) Taiwan
G-Y. Yeom (Sungkyunkwan University) Korea
S-J. Yoo (NFRI) Korea

Executive Committee

Chair:  K. Sasaki (Hokkaido University) Japan
Vice-chair: S. Hamaguchi (Osaka University) Japan
Vice-chair: H. Akatsuka (Tokyo Institute of Technology) Japan
N. Koshizaki (Hokkaido University) Japan
S. Nishiyama (Hokkaido University) Japan
K. Satoh (Muroran Institute of Technology) Japan
T. Tomioka (Hokkaido University) Japan
N. Shirai (Hokkaido University) Japan

Publication Committee

Chair:  K. Ishikawa (Nagoya University) Japan
Vice-chair:  T. Ichiki (The University of Tokyo) Japan
Vice-chair:  K. Karahashi (Osaka University) Japan
K. Eriguchi (Kyoto University) Japan
S. Higashi (Hiroshima University) Japan
N. Itabashi (Hitachi, Ltd.) Japan
K. Kinoshita (PETRA) Japan
N. Kuboi (Sony Semiconductor Solutions Corp.) Japan
H. Kuwano (Tohoku University) Japan
S. Nunomura (Advanced Industrial Science and Technology-AIST) Japan
L. Overzet (University of Texas at Dallas) USA
O. Sakai (University of Shiga Prefecture ) Japan
K. Sasaki (Hokkaido University) Japan
Y. Shimogaki (The University of Tokyo) Japan
M. Shiratani (Kyushu University) Japan
E. Stamate (Technical University of Denmark) Denmark
K. Takahashi (Kyoto Institute of Technology) Japan

Program Committee

Chair:  M. Honda (TOKYO ELECTRON MIYAGI LTD.) Japan
Vice-chair:  T. Okumura (Panasonic Corp.) Japan
Vice-chair:  M. Matsui (Hitachi, Ltd.) Japan
K. Azuma (Shimadzu Corp.) Japan
J-P. Booth (CNRS/Ecole Polytechnique) France
K-N. Chen (National Chiao Tung University) Taiwan
A. Dzarasova (Quantemol Ltd.) UK
D.J. Economou (University of Houston) USA
E. Eriguchi (Kyoto University) Japan
M. Fukasawa (Sony Semiconductor Solutions Corp.) Japan
H. Hayashi (Toshiba Corp.) Japan
N. Hayashi (Kyushu University) Japan
T. Hayashi (Nagoya University) Japan
S. Higashi (Hiroshima University) Japan
M. Hiramatsu (Meijo University) Japan
T. Ichiki (The University of Tokyo) Japan
K. Ishikawa (Nagoya University) Japan
N. Itabashi (Hitachi, Ltd.) Japan
S. Y. Kang (Tokyo Electron Ltd.) Japan
S. Kanakasabapathy (IBM Corp.) USA
K. Karahashi (Osaka University) Japan
Y. Kim (Hynix Semiconductor Inc.) Korea
H. Kobayashi (Hitachi, Ltd.) Japan
K. Koga (Kyushu University) Japan
H. Kokura (Samsung Electronics Co., Ltd.) Korea
H. Kondo (Nagoya University) Japan
A. Koshiishi (Samsung Electronics Co., Ltd.) Korea
T. Koshizawa (Applied Materials Inc.) Japan
N. Kuboi (Sony Semiconductor Solutions Corp.) Japan
S. Kumagai (Toyota Technological Institute) Japan
K. Kurihara (Toshiba Corp.) Belgium
H. Kuwano (Tohoku University) Japan
J-F. de Marneffe (Interuniversity Microelectronics Center-IMEC) Belgium
T. Maruyama (Renesas Electronics Corp.) Japan
H. Miyazoe (IBM Corp.) USA
S. Miyazaki (Nagoya University) Japan
Y. Morikawa (ULVAC Inc.) Japan
M. Morimoto (Hitachi High-Technologies Taiwan Corp.) Taiwan
K. Nakamura (Chubu University) Japan
M. Nakamura Japan (MAMO) Japan
M. Nakatani (Panasonic Corp.) Japan
N. Negishi (Hitachi, Ltd.) Japan
K. Nojiri (Lam Research Corp.) Japan
S. Nunomura (Advanced Industrial Science and Technology -AIST) Japan
H. Ohtake (Tokyo Electron Ltd.) USA
F. Roozeboom (Eindhoven University of Technology-TU/e) Netherlands
Y. Sakiyama (Lam Research Corp.) USA
K. Sasaki (Hokkaido University) Japan
M. Sekine (Nagoya University) Japan
Y. Setsuhara (Osaka University) Japan
D. Shamiryan (Mapper) Russia
Y. Shimogaki (The University of Tokyo) Japan
K. Shin (Samsung Electronics Co., Ltd.) Korea
T. Shirafuji (Osaka City University) Japan
M. Shiratani (Kyushu University) Japan
E. Stamate (Technical University of Denmark) Denmark
K. Takahashi (Kyoto Institute of Technology) Japan
H. Toyoda (Nagoya University) Japan
T. Watanabe (Waseda University) Japan
T. Yagisawa (Toshiba Corp.) Japan
H. Yamauchi (Sharp Corp.) Japan
G-Y. Yeom (Sungkyunkwan University) Korea

International Advisory Committee

Chair:  J. Nishizawa (Tohoku University) Japan
R. A. Gottscho (Lam Research Corp.) USA
S. Fujimura (Tokyo Institute of Technology) Japan
J-G. Han (Sungkyunkwan University) Korea
Y. Horiike (Tsukuba University) Japan
K. Horioka (Applied Materials Inc.) Japan
T. Makabe (Keio University) Japan
K. Ono (Osaka University) Japan
H. Sugai (Nagoya University) Japan
K. Tachibana (Osaka Electro-Communication University) Japan
O. Takai (Kanto Gakuin University) Japan
K. Tsujimoto (JST) Japan
M. Yoneda ( ULVAC Inc.) Japan
S. Zaima (Nagoya University) Japan