We realize that the COVID-19 outbreak is impacting every one of us and we hope that you and families are all safe. The health and safety of our attendees and staff is our top priority and we are continuing to monitor developments related to the COVID-19 outbreak and its impact on global travel.
At this time, we are moving forward with planning for DPS2020 on November anticipating that this pandemic will be under control by then. If we are still dealing with severe travel restrictions by the end of the summer, we will evaluate options and advise of any changes or cancellation. All updates will be communicated immediately to all registered meeting attendees and posted on the meeting website.
We understand that the evolving situation may affect your plans to submit an abstract by the July deadline. If you have any questions, please contact email@example.com.
For the most up-to-date information regarding the virus, please refer to the World Health Organization and Ministry of Health, Labour and Welfare, Japan web pages.
The 42nd International Symposium on Dry Process (DPS2020) will be held at Masaru Ibuka Auditorium, Waseda University, Tokyo, Japan, from November 19 to 20, 2020. The Symposium covers all aspects of the rapidly evolving fields of dry processes, including but not limited to plasma etching and deposition processes, diagnostics and modeling of plasmas and surfaces, and surface modifications by plasmas, for the applications in, e.g., microelectronics, power devices, sensors, environmental protection, biological systems, and medicine. The DPS has provided valuable forums for in-depth discussion among professionals and students working in this exciting field for more than four decades.
|Abstract Submission Deadline:||July 17, 2020|
|Early Registration Deadline:||October 9, 2020|
|Late Registration Deadline (Online):||October 31, 2020|
- Feb. 3, 2020
- DPS2020 website open.
News for the Special Issues of Japanese Journal of Applied Physics (JJAP).
IF for the special issue of DPS in JJAP
DPS paper award that is given to excellent papers in the recent special issues of “Dry Process”, and the article is set “Open Access” for ever.
DPS2018 DPS Paper Award: "Atomic layer etching of silicon nitride using infrared annealing for short desorption time of ammonium fluorosilicate",
Nobuya Miyoshi, Hiroyuki Kobayashi, Kazunori Shinoda, Masaru Kurihara, Tomoyuki Watanabe, Yutaka Kouzuma, Kenetsu Yokogawa, Satoshi Sakai, Masaru Izawa
JJAP, 56(2017), 06HB01
DPS2017 DPS Paper Award: "Highly selective etching of LaAlSiOx to Si using C4F8/Ar/H2 plasma",
Sasaki, Toshiyuki; Matsuda, Kazuhisa; Omura, Mitsuhiro; Sakai, Itsuko; Hayashi, Hisataka
JJAP, 54(2015), 06GB03
DPS2016 DPS Paper Award: "Plasma process induced physical damages on multilayered magnetic films for magnetic domain wall motion",
Kinoshita, Keizo; Honjo, Hiroaki; Fukami, Shunsuke; et al.
JAPP, 53(2014), 03DF03
DPS2015 DPS Paper Award: "Effects of straggling of incident ions on plasma-induced damage creation in "fin"-type field-effect transistors",
Eriguchi, Koji; Matsuda, Asahiko; Takao, Yoshinori; et al.
JJAP, 53(2014), 03DE02
“Progress in nanoscale dry processes for fabrication of high-aspect-ratio features: How can we control critical dimension uniformity at the bottom?”,
Kenji Ishikawa, Kazuhiro Karahashi, Tatsuo Ishijima, Sung Il Cho, Simon Elliott, Dennis Hausmann, Dan Mocuta, Aaron Wilson and Keizo Kinoshita
- The publication charge is 40000JPY/article.
- JJAP Special Issues is published in the web site;
DPS2018 (Jpn. J. Appl. Phys. 58 June 2019.)(Free until June 2020)
DPS2017 (Jpn. J. Appl. Phys. 57 June 2018.)
DPS2016 (Jpn. J. Appl. Phys. 56 June 2017.)
DPS2015（Jpn. J. Appl. Phys. 55(6S2) June 2016）
DPS2014（Jpn. J. Appl. Phys. 54(6S2) June 2015）
DPS2013（Jpn. J. Appl. Phys. 53 (3S2) March 2014）