DPS2022 43rd International Symposium on Dry Process

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In conjunction with

Scope

The 43rd International Symposium on Dry Process (DPS2022) will be held at Osaka International Convention Center, (Osaka, Japan) & Online from November 24 to 25, 2022. DPS2022 will be a hybrid symposium that will run in-person (number of attendees limited) and virtually. The Symposium covers all aspects of the rapidly evolving fields of dry processes, including but not limited to plasma etching and deposition processes, diagnostics and modeling of plasmas and surfaces, and surface modifications by plasmas, for the applications in, e.g., microelectronics, power devices, sensors, environmental protection, biological systems, and medicine. The DPS has provided valuable forums for in-depth discussion among professionals and students working in this exciting field for more than three decades.
<Possibility of Change of Meeting Format>
Please note that DPS2022 may go fully online depending on the COVID-19 situation.


abstract submission   
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Important dates

Abstract Submission Deadline: July 22, 2022
Early Registration Deadline: October 7, 2022
Late Registration Deadline (Online): December 2, 2022

Recent Updates

Jun. 27, 2022
Registration system opened.
Jun. 09, 2022
Timetable(Tentative) is available.
May. 16, 2022
On-Line Submission system is opened.
Feb. 7, 2022
DPS2022 website open.

News for the Special Issues of Japanese Journal of Applied Physics (JJAP).

IF for the special issue of DPS in JJAP

1.67 (2017)

OPEN ACCESS & FREE ACCESS

Regular Papers

DPS paper award that is given to excellent papers in the recent special issues of "Dry Process" and the articles are set "Open Access" for ever, or "Free Access" until December 2025.

DPS2020 DPS Paper Award: "Formation mechanism of sidewall striation in high-aspect-ratio hole etching"
M. Omura, J. Hashimoto, T. Adachi, Y. Kondo, M. Ishikawa, J. Abe, I. Sakai, H. Hayashi, M. Sekine, M. Hori
JJAP 58, SEEB02 (2019)

DPS2019 DPS Paper Award: "A method for high selective etch of Si3N4 and SiC with ion modification and chemical removal"
Sho Kumakura, Masahiro Tabata and Masanobu Honda
JJAP, 58(2019), SEEB01

DPS2018 DPS Paper Award: "Atomic layer etching of silicon nitride using infrared annealing for short desorption time of ammonium fluorosilicate",
Nobuya Miyoshi, Hiroyuki Kobayashi, Kazunori Shinoda, Masaru Kurihara, Tomoyuki Watanabe, Yutaka Kouzuma, Kenetsu Yokogawa, Satoshi Sakai, Masaru Izawa
JJAP, 56(2017), 06HB01

DPS2017 DPS Paper Award: "Highly selective etching of LaAlSiOx to Si using C4F8/Ar/H2 plasma",
Sasaki, Toshiyuki; Matsuda, Kazuhisa; Omura, Mitsuhiro; Sakai, Itsuko; Hayashi, Hisataka
JJAP, 54(2015), 06GB03

DPS2016 DPS Paper Award: "Plasma process induced physical damages on multilayered magnetic films for magnetic domain wall motion",
Kinoshita, Keizo; Honjo, Hiroaki; Fukami, Shunsuke; et al.
JAPP, 53(2014), 03DF03

DPS2015 DPS Paper Award: "Effects of straggling of incident ions on plasma-induced damage creation in "fin"-type field-effect transistors",
Eriguchi, Koji; Matsuda, Asahiko; Takao, Yoshinori; et al.
JJAP, 53(2014), 03DE02


Progress Reviews

"Rethinking surface reactions in nanoscale dry processes towardatomic precision and beyond: a physics and chemistry perspective"
Kenji Ishikawa, Tatsuo Ishijima, Tatsuru Shirafuji, Silvia Armini, Emilie Despiau-Pujo, Richard A. Gottscho, Keren J. Kanarik, Gert J. Leusink, Nathan Marchack, Takahide Murayama, Yasuhiro Morikawa, Gottlieb S. Oehrlein, Sangwuk Park, Hisataka Hayashi and Keizo Kinoshita
JJAP.58(2019), SE0801

"Progress and perspectives in dry processes for nanoscale featurefabrication: fine pattern transfer and high-aspect-ratio featureformation"
Taku Iwase, Yoshito Kamaji, Song Yun Kang, Kazunori Koga, Nobuyuki Kuboi, Moritaka Nakamura, Nobuyuki Negishi, Tomohiro Nozaki, Shota Nunomura, Daisuke Ogawa, Mitsuhiro Omura, Tetsuji Shimizu, Kazunori Shinoda, Yasushi Sonoda, Haruka Suzuki, Kazuo Takahashi, Takayoshi Tsutsumi, Kenichi Yoshikawa, Tatsuo Ishijima and Kenji Ishikawa
JJAP.58(2019), SE0802

"Progress and perspectives in dry processes for emergingmultidisciplinary applications: how can we improve our use of dry processes?"
Taku Iwase, Yoshito Kamaji, Song Yun Kang, Kazunori Koga, Nobuyuki Kuboi, Moritaka Nakamura, Nobuyuki Negishi, Tomohiro Nozaki, Shota Nunomura, Daisuke Ogawa, Mitsuhiro Omura, Tetsuji Shimizu, Kazunori Shinoda, Yasushi Sonoda, Haruka Suzuki, Kazuo Takahashi, Takayoshi Tsutsumi, Kenichi Yoshikawa, Tatsuo Ishijima and Kenji Ishikawa
JJAP.58(2019), SE0803

"Progress and perspectives in dry processes for leading-edgemanufacturing of devices: toward intelligent processes and virtualproduct development"
Taku Iwase, Yoshito Kamaji, Song Yun Kang, Kazunori Koga, Nobuyuki Kuboi, Moritaka Nakamura, Nobuyuki Negishi, Tomohiro Nozaki, Shota Nunomura, Daisuke Ogawa, Mitsuhiro Omura, Tetsuji Shimizu, Kazunori Shinoda, Yasushi Sonoda, Haruka Suzuki, Kazuo Takahashi, Takayoshi Tsutsumi, Kenichi Yoshikawa, Tatsuo Ishijima and Kenji Ishikawa
JJAP.58(2019), SE0804

"Progress in nanoscale dry processes for fabrication of high-aspect-ratio features: How can we control critical dimension uniformity at the bottom?”,
Kenji Ishikawa, Kazuhiro Karahashi, Tatsuo Ishijima, Sung Il Cho, Simon Elliott, Dennis Hausmann, Dan Mocuta, Aaron Wilson and Keizo Kinoshita
JJAP.57(2018).06JA01