DPS2017 - 39th International Symposium on Dry Process

Nishizawa Award Lecture

• Prof. David Barry Graves (University of California, Berkeley)
  "lasma-surface interactions: challenges that span applications"
• Prof. Toshiaki Makabe (Keio University)
  "Historical developments of the velocity distribution of electrons in time-varying low-temperature plasmas"

Keynote speaker and title 

• Dan Mocuta (imec)
  "Is there still plenty of room at the bottom? A perspective on technology scaling"

Invited speakers and titles 

A1. Surface reactions for atomic layer controlled processes (ALE/ALD)

• Simon Elliott (University College Cork)
  "Insights into self-limiting surface reactions from atomic-scale simulations"
• Dennis Hausmann (Lam Research Corp.)
  "Atomic Layer Deposition of Silicon Dielectrics: Precursors, Processes, and Plasmas"

A2. Etching technologies for latest devices having high-aspect-ratio of 50 or more (HAR）

• Yoon-Jae Kim (Samsung Electronics Co., Ltd.)
  "The Historical Trend of HARC Etch Technology and New Challenges"
• Mark J. Kushner (University of Michigan)
  "High and Moderate Aspect Ratio Etching: Insights from Modeling"
• Aaron Wilson (Micron Technology, Inc.)
  "Dry Etch Scaling Challenges for High Aspect Ratio 3D NAND and DRAM Memory Technologies"