Keynote / Invited Speakers
Invited speakers and titles
AS1. Understanding the mechanisms for future high-aspect-ratio etching technology
- Kye H. Baek (Micron Technology, Inc.)
"HARC etching technology, its innovation is ongoing" - Sung-Il Cho (Samsung Electronics Co., Ltd.)
"Breaking new ground : From current progress to future innovations in HARC etching technology"
AS2. Atomic layer processes (ALE/ALD/ASD) for ultimate control of surface reaction
- Vincent M. Donnelly (University of Houston)
"Mechanistic Insights and New Approaches to Atomic Layer Etching of Silicon in Chlorine and Bromine-Containing Plasmas" - Christophe Vallee (University at Albany)
"Engineering plasma for atomic scale processing: ALD, ALE and ASD"
AS3. Dry process technology for 3D-IC and advanced packaging
- Jeongsoo Kim (imec)
"Dry etch process technology for 3D-IC and advanced packaging" - Chulhyun Lim (Samsung Electronics Co., Ltd.)
"Packaging Innovations: Leveraging the dry etch process for Hybrid Copper Bonding die singulation"