DPS2025 46th International Symposium on Dry Process

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Keynote / Invited Speakers

Nishizawa Award Lectures

  • Masaru Izawa (Hitachi High-Tech Corporation)
    "Understanding Plasma Etching Processes through Surface Reaction Models"

Invited speakers and titles

AS1. Understanding the mechanisms for future high-aspect-ratio etching technology
  • Sung-Il Cho (Samsung Electronics Co., Ltd.)
    "Breaking new ground : From current progress to future innovations in HARC etching technology"
AS2. Atomic layer processes (ALE/ALD/ASD) for ultimate control of surface reaction
  • Vincent M. Donnelly (University of Houston)
    "Mechanistic Insights and New Approaches to Atomic Layer Etching of Silicon in Chlorine and Bromine-Containing Plasmas"
  • Christophe Vallee (University at Albany)
    "Engineering plasma for atomic scale processing: ALD, ALE and ASD"
AS3. Dry process technology for 3D-IC and advanced packaging
  • Jeongsoo Kim (imec)
    "Dry etch process technology for 3D-IC and advanced packaging"
  • Chulhyun Lim (Samsung Electronics Co., Ltd.)
    "Packaging Innovations: Leveraging the dry etch process for Hybrid Copper Bonding die singulation"