Scope
The 45th International Symposium on Dry Process (DPS2024) will be held at Chitose Civic Culture Center, Hokkaido, Japan from November 14 to 15, 2024. The Symposium covers all aspects of the rapidly evolving fields of dry processes, including but not limited to plasma etching and deposition processes, diagnostics and modeling of plasmas and surfaces, and surface modifications by plasmas, for the applications in, e.g., microelectronics, power devices, sensors, environmental protection, biological systems, and medicine. The DPS has provided valuable forums for in-depth discussion among professionals and students working in this exciting field for more than four decades.
Important dates
Abstract Submission Deadline: | July 15, 2024 |
Notification of Abstract Acceptance: | September 13, 2024 |
Early Registration Deadline: | September 30, 2024 |
Late Registration Deadline (Online): | October 25, 2024 |
Publish Proceedings (Abstracts): | November 7, 2024 |
Recent Updates
- Jul. 19, 2024
- Information/Guideline for DPS Career Assistant Board is available.
- Jun. 24, 2024
- Registration Online opened.
- Jun. 21, 2024
- Timetable(Tentative) is available.
- May 08, 2024
- On-Line Submission system is opened.
- Feb. 06, 2024
- DPS2024 website open.
News for the Special Issues of Japanese Journal of Applied Physics (JJAP).
IF for the special issue of DPS in JJAP
1.67 (2017)
- The publication charge is 40000JPY/article.
https://iopscience.iop.org/journal/1347-4065/page/About - JJAP Special Issues is published in the web site;
DPS2023 (Jpn. J. Appl. Phys. 63 July 2024.) (Free until July 2025)
https://iopscience.iop.org/collections/jjap-240402-02
DPS2022 (Jpn. J. Appl. Phys. 62 July 2023.) (Free until July 2024)
https://iopscience.iop.org/issue/1347-4065/62/SI
DPS2021 (Jpn. J. Appl. Phys. 61 July 2022.)
https://iopscience.iop.org/issue/1347-4065/61/SI
DPS2019 (Jpn. J. Appl. Phys. 59 June 2020.)
https://iopscience.iop.org/issue/1347-4065/59/SJ
DPS2018 (Jpn. J. Appl. Phys. 58 June 2019.)
https://iopscience.iop.org/issue/1347-4065/58/SE
OPEN ACCESS & FREE ACCESS