DPS 2018 40th International Symposium on Dry Process


Keynote / Invited Speakers

Nishizawa Award Lecture

  • Dr. Nobuo Hayasaka (Toshiba Memory Corporation)
    "Dry Process Symposium and My Semiconductor Career"
  • Dr. Moritaka Nakamura (MAMO)
    "Era of in-house etcher development by semiconductor manufacturing companies – focusing around the topics not reported at scientific meetings as DPS"
  • Prof. Kouichi Ono (Osaka University)
    "Atomistic view of dry process: Looking back to go beyond"
  • Dr. Kazunori Tsujimoto
    "Memories of development on the new plasma etching technologies for plasma and surface control"

Keynote speaker and title

  • Richard Gottscho (Lam Research Corp.)
    "Rethinking the Art of Etch"

Invited speakers and titles

A1. Control of surface reactions in atomic-precision plasma processing (ALE/ALD)
  • Silvia Armini (imec)
    "Area-selective deposition by surface engineering for applications in nanoelectronics. From blanket to confined dimensions."
  • Gert Leusink (Tokyo Electron U.S. Holdings, Inc.)
    "Area Selective Processes for Advanced Devices: Challenges and Opportunities"
  • Gottlieb S. Oehrlein (University of Maryland)
    "Materials Etching Selectivity in Plasma-Based Fluorocarbon Atomic Layer Etching (ALE)"
  • Emilie Despiau-Pujo (University of Grenoble Alpes)
    "Plasma solutions for atomic-precision etching: From atomistic simulations to experiments"
A2. Etching challenges in extremely high-aspect-ratio (HAR) features (AR > 100)
  • Sangwuk Park (Samsung Electronics Co., Ltd.)
    "Etching challenges in extremely high-aspect-ratio (HAR) features"
9. Plasma Processes for 3D Device, FPD, Photovoltaic Devices
  • Yasuhiro Morikawa (ULVAC Inc.)
    "Plasma Dry Process Technology for Fan-out SiP"
10. Plasma Processes for New Material Devices (MRAM, Power, Organic)
  • Nathan Marchack (IBM Corp.)
    "Towards Atomic Layer Etching of Metal Nitride Films: Understanding the Impact of Plasma Etch Parameters on Cyclic Etch Performance"