Invited speakers and tentative titles
Invited speakers and tentative titles
AS1. Challenges to limits for high aspect ratio etching
- Zoltan Donko (Wigner Research Center for Physics)
"Charged particle dynamics in capacitively coupled radiofrequency discharges driven by complex waveforms"
AS2. Novel control of surface reaction in atomic layer processes (ALE / ALD / Area selective ALD)
- Alok Ranjan (Tokyo Electron America)
"Breakthrough technologies for opening process windows for sub-nanoscale precision etch"
AS3. 3D-IC packaging for energy-saving and high-density interconnection
- Clinton Goh (Applied Materials, Inc.)
"Plasma Processing for Next Generation Packaging System Scaling"