Invited speakers and tentative titles

AS1. Challenges to limits for high aspect ratio etching

Zoltan Donko (Wigner Research Center for Physics)
"Charged particle dynamics in capacitively coupled radiofrequency discharges driven by complex waveforms"

AS2. Novel control of surface reaction in atomic layer processes (ALE / ALD / Area selective ALD)

Alok Ranjan (Tokyo Electron America)
"Breakthrough technologies for opening process windows for sub-nanoscale precision etch"

AS3. 3D-IC packaging for energy-saving and high-density interconnection

Clinton Goh (Applied Materials, Inc.)
"Plasma Processing for Next Generation Packaging System Scaling"