Keynote / Invited Speakers
Nishizawa Award Lectures
- Jean-Paul Booth (CNRS/Ecole Polytechnique)
"Improving our understanding of plasma-surface interactions through in-situ measurements" - Nobuo Fujiwara (Mitsubishi Electric Corp.)
"DPS as a forum to share emerging challenges"
Invited speakers and titles
AS1. Challenges to overcome the limits for high aspect ratio etching
- Mark J. Kushner (University of Michigan)
"Engineering Reactor and Feature Scale Processes for High Aspect Ratio Plasma Etching" - Jaeho Min (Samsung Electronics Co., Ltd.)
"Key Parameters of Realizing High Aspect Ratio Contact Etch in VNAND Channel Hole"
AS2. Atomic layer processes (ALE/ALD/ASD) toward 2nm and beyond
- Satoshi Hamaguchi (Osaka University)
"Plasma-surface interactions for atomic layer processes"
AS3. How AI and Machine Learning are transforming dry process technologies
- Richard A. Gottscho (Lam Research Corp.)
"Attacking the Little Data Problem in Research and Development" - Jun Haeng Lee (Samsung Electronics Co., Ltd.)
"AI-Driven Plasma Dry Etch Recipe Optimization: Challenges, Approaches, and Practical Insights"
Advanced Packaging
- Yasumitsu Orii (Rapidus Corporation)
"Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era"