Poster Session
Presentation guideline
Poster session is divided into two halves in order to prevent congestion.
At least one of the authors must stay in front of the poster during the assigned Core-Time:
Core-time (1) 10:40 -11:40 † Odd numbers
Core-time (2) 11:40 -12:40 ‡ Even numbers
Etching Technology
- ‡P-2 H. Ikeo
Etching Characteristics of GaN and Role of Hydrogen Atoms in Hydrogen plasmas
- †P-3 T. Hayashi
Dissociative properties of C4F6 obtained using computational chemistry
- ‡P-4 C. Abe
High aspect ratio SiO/SiN (ON) stacked layer etching using C3HF5 gas
- †P-5 M. Tohnishi
Fabrication of nonreflective black germanium in near-infrared region up to a wavelength of 2.5 μm by SF6+O2/C4F8-plasma-based deep reactive ion etching
- ‡P-6 H. S. Gil
Isotropic etching characteristics of SiNx and SiO2 according to the Cl/F species ratio in a remote
- †P-7 S. B. Kim
High Aspect Ratio Dielectric Etching using Highly Polymeric HFC (CHF3, CxHyFz, x=3, 4) Gases
Manufacturing Technologies (AEC, APC, EES, FDC)
- ‡P-8 J. Ichihara
Development of Sapphire Capacitance Manometer (model: V8S)
- †P-9 E. Park
Fault Detection using Optical Emission Spectroscopy Signals with Principal Component Analysis in Plasma Etching Processes
Surface Reaction and Damage
- ‡P-10 S. Kawabata
Tungsten surface reactions by fluorocarbon ion beam injections
- †P-11 S. Nunomura
Defect characterization at SiO2/Si interface throughout plasma processing and annealing
- ‡P-12 T. Ishino
XPS measurement of zirconium oxynitride thin films deposited by reactive magnetron sputtering
- †P-13 A. Kuwada
Effects of He dilution on chemical states in amorphous carbon films deposited by acetylene plasma
- ‡P-14 M. Shinohara
Deposition Process of carbon film during Methyl-acetylene plasma, Investigated with Infrared Spectroscopy
- †P-15 K. Watanabe
XPS Surface Analysis of Multi-walled Carbon Nanotubes Exposed to Nitrogen/Carbon Dioxide Plasma
Plasma Diagnostics and Monitoring Systems
- ‡P-16 M. K. T. Mo
Simultaneous measurements of F, O and H ground state atom density in an industry-grade etching plasma
- †P-17 T. Nakano
Study on Energy Carriers’ contribution of Atmospheric Pressure Plasma Jet
- †P-19 Y. Kihira
Investigation of Effects on curling probe to be embedded into an electrode
- ‡P-20 H. Kato
Quantitative evaluation of ion composition in Ar/C4F8/O2 pulsed capacitively-coupled plasma based on electron impact ionization rates
- †P-21 S. Lee
Virtual Metrology using Multi-channel Optical Emission Spectroscopy for Etching Uniformity Monitoring
- ‡P-22 S. Matsumoto
Effect of pulse length on high-power pulsed magnetron sputtering using carbon target
Computational Approaches (Modeling, Simulation, Machine Learning, AI, Informatics, DX) for Dry Process
- †P-23 N. A. Mauchamp
Molecular Dynamics simulations of reactive ion etching of tungsten (W) by energetic fluorocarbon ions
- ‡P-24 J. H. Shin
A two-dimensional particle-in-cell simulation of electron heating by the material surface reactions in Ar capacitively coupled plasmas
- †P-25 Y. Shimada
Evaluation method of plasma fluctuation using stochastic model
- ‡P-26 H. Shen
Efficiency Improvement on Physical Model Establishment for Dry Etch Simulation by Using Machine Learning
- †P-27 S. Kato
Numerical Analysis for Curling Probe Antenna
- ‡P-28 H.-C. Tsai
Parallel 2-D Axisymmetric Fluid Model of Dual Radio-Frequency Argon Capacitively Coupled Plasma Discharge
- †P-29 J. H. Youn
Enhanced Temperature Uniformity of Electrostatic Chuck: Ceramic Surface Contact Ratio
- ‡P-30 S. Kawaguchi
Physics-informed neural networks for calculating time-periodic EVDF under RF electric fields
- †P-31 K. Kamataki
Combining machine learning of classification and regression models for predicting high quality amorphous ITO films fabricated by RF plasma sputtering
Plasma Generation (Equipment/Source)
- ‡P-32 Y. Ohtsu
Production of high-density hydrogen plasma by RF magnetized hollow cathode discharge with magnet
- †P-33 K. Imanaka
Atmospheric pressure helium microplasmas using micro hollow array electrode for polymer surface modification
- ‡P-34 K. Takahashi
Observation of argon plasma driven by 150 kHz band high power burst pulse voltage
Deposition Technologies (CVD / PVD)
- †P-35 M. Murugesh
Robustness of amorphous carbon shell against melting of tin core of core-shell nanoparticle synthesized using dusty plasma
- ‡P-36 W. Poonthong
Development of Ar + O2 + Zn Powder Mixing Gas at Low-pressure High-frequency Plasma Chemical Vapor Deposition Process System
- †P-37 T. Kimura
Vanadium oxide films synthesized via reactive HiPIMS combined with multi pulse magnetron sputtering
- ‡P-38 H. Kawasaki
Relation between crystallinity of the films and solid density of the target by sputtering depotion with mixture powder targets
- †P-39 S. Watanabe
High-Speed Deposition of Ta-C Film by DC Linear Filtered Arc Deposition Employing Coiled Anode
- ‡P-40 H. Kunieda
Deposition of diamond-like carbon using unipolar-double-pulse high-power pulsed magnetron sputtering
- †P-41 Y. Miyaji
Photocatalytic Characteristics of TiO2/Au/TiO2/Au Stacked Nanostructure Induced by Ultraviolet and Visible light Irradiation
- ‡P-42 T. Ohshima
Preparation of nickel nitride thin films using ammonia, nitrogen and nitric oxide gases by PLD method
- †P-43 Y. Saitoi
Deposition of tin oxide film using high-power pulsed magnetron sputtering
- ‡P-44 K. Nagahashi
Low-temperature deposition of crystalline zinc oxide film using high-power pulsed magnetron sputtering
- †P-45 K. Takeda
Effect of rare gas on deposition of diamond-like carbon film using high-power pulsed magnetron sputtering
- ‡P-46 K. Takenaka
Fabrication of amorphous gallium oxide thin film transistors by plasma-assisted reactive processes
- †P-47 K. Ishigure
Carbon nitride synthesis on carbon nanowalls using thermal CVD with melamine gas
- ‡P-48 K. Ishikawa
Deposition of nitrogen-doped diamond by Radical Injection-CVD
- †P-49 N. Sato
OES Identification of ZnO molecule in ICP for ZnO-TCF synthesis
- ‡P-50 S. Ono
Comparative study of deposition characteristics of different precursors for plasma CVD
Atomic Layer Processes (ALD/ALE)
- †P-51 H. Ha
Plasma Atomic Layer Etching for Titanium Nitride with Surface Fluorination using NF3 Plasma and Ar Ion Bombardment
- ‡P-52 E. Kang
Mechanism of an atomic layer etching process using alternative gas radicals
- †P-53 S. Son
A study on the atomic layer etching process using liquid fluorocarbon gas
- ‡P-54 D. Hong
Anisotropic Atomic Layer Etching of SiO2 and Si3N4 using Low Global Warming C4H3F7O Isomers
Dry process for Green Transformation:GX (Energy saving technology, Alternative gas, 3D-IC/Packaging)
- †P-55 S. Endo
VUV Absorption Characteristics of Epoxy Resin in Surface Modification using Excimer Lamp
- ‡P-56 T. Matsumoto
Photocatalytic Activity Enhancement of Titanium Dioxide Nanoparticles via High-Pressure Annealing with Polyethylene Glycol
- †P-57 A. Ichimura
Photocatalytic Activity of g-C3N4 Nanosheets Grown by High-Pressure Annealing
Plasma Processes for New Material Devices (MRAM, Power, Organic, III-V, 2D)
- ‡P-58 M. Sasaki
Isolated Voltage Sensor Using Tuning Fork Resonator
Plasma Processes for Biological and Medical application, MEMS
- †P-59 S. Kumagai
Analysis of plasma exposure effects on C. Elegans
- ‡P-60 H. Okino
Development of microperfusion system for stable and promoted cell growth
- †P-61 K. Koga
Quantitative Analysis of Electric Field Intensity Generated by Scalable Dielectric Barrier Discharge Electrodes for Irradiating to Plant Seeds
- ‡P-62 J. Kagami
Evaluation of glucose oxidase on carbon nanowalls
- †P-63 H. Kurita
Investigation of intracellular reactive species generated by cold atmospheric pressure plasma irradiation
Atmospheric Pressure Plasma and Liquid Plasma
- ‡P-64 K. Ohashi
Increased Polyphenol Content of Harvested Onions Irradiated with Low-Temperature Air Plasma Jet at Quasi-Atmospheric Pressure
- †P-65 Y. Makino
Bacterial Inactivation of Pt-doped Rutile TiO2 Nanoparticles Annealed with Low-Temperature O2 Plasma
- ‡P-66 A. Kajino
Atmospheric pressure hybrid plasma jet with two types of discharge system
New Dry Process Concepts
- †P-67 A. Shimizu
Comparison of Vacuum Ultraviolet Light Irradiation and Plasma Treatment as Pretreatment of Direct Copper Seed Layer on Cycloolefin Polymer
- ‡P-68 Y. Aihara
One-step formation of ZrN on surface of carbon fine particles for membrane electrode assembly
- †P-69 K. Sakuta
Temperature dependence on metal etching using reactive gas adsorption and GCIB
- ‡P-70 H. Tanaka
Surface modification and etching of metal films by neutral cluster beam irradiation